𝔖 Bobbio Scriptorium

✦ LIBER ✦

Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates

✍ Scribed by Kim, C. H.; Kwon, Y.-S.

Book ID: 117913347
Publisher: Institute of Electrical and Electronics Engineers
Year: 2012
Tongue: English
Weight: 588 KB
Volume: 2
Category: Article
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2011.2180905

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Quasi-Coaxial Vertical via Transitions f

Quasi-Coaxial Vertical via Transitions for 3-D Packages Using Anodized Aluminum Substrates

✍ Sung-Ku Yeo, ; Kyoung-Min Kim, ; Jong-Hoon Chun, ; Young-Se Kwon, 📂 Article 📅 2009 🏛 IEEE 🌐 English ⚖ 594 KB

[IEEE 2007 European Microwave Conference

[IEEE 2007 European Microwave Conference - Munich, Germany (2007.10.9-2007.10.12)] 2007 European Microwave Conference - An X-band high power amplifier module package using selectively anodized aluminum substrate

✍ Sung-Ku Yeo, ; Jong-Hoon Chun, ; Kyoung-Min Kim, ; Jong-Min Yook, ; Young-Se Kwo 📂 Article 📅 2007 🏛 IEEE ⚖ 533 KB

[IEEE 2007 1st Asian and Pacific Confere

[IEEE 2007 1st Asian and Pacific Conference on Synthetic Aperture Radar - Huangshan, China (2007.11.5-2007.11.9)] 2007 1st Asian and Pacific Conference on Synthetic Aperture Radar - Fabrication of the tile type transceiver module package for X-band phase array radar using selectively anodized aluminum substrate

✍ Jong-Hoon Chun, ; Sung-Ku Yeo, ; Young-Se Kwon, 📂 Article 📅 2007 🏛 IEEE ⚖ 394 KB