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Quasi-Coaxial Vertical via Transitions for 3-D Packages Using Anodized Aluminum Substrates

✍ Scribed by Sung-Ku Yeo, ; Kyoung-Min Kim, ; Jong-Hoon Chun, ; Young-Se Kwon,

Book ID: 126161951
Publisher: IEEE
Year: 2009
Tongue: English
Weight: 594 KB
Volume: 19
Category: Article
ISSN: 1531-1309
DOI: 10.1109/LMWC.2009.2020016

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