✦ LIBER ✦

Thermomigration and electromigration in Sn58Bi ball grid array solder joints

✍ Scribed by X. Gu; K. C. Yung; Y. C. Chan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermomigration and electromigration in

✍ X. Gu; K. C. Yung; Y. C. Chan; D. Yang 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 397 KB

Electromigration-induced Bi-rich whisker

✍ Hongwen He; Guangchen Xu; Fu Guo 📂 Article 📅 2010 🏛 Springer 🌐 English ⚖ 557 KB

Electromigration-enhanced intermetallic

✍ Hongwen He; Guangchen Xu; Fu Guo 📂 Article 📅 2010 🏛 Springer 🌐 English ⚖ 512 KB

Tensile test behavior of the eutectic Sn

✍ M. S. Yeh; J. T. Chiang 📂 Article 📅 2004 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 550 KB

Interfacial reactions and mechanical pro

✍ Chih-Ming Chen; Huei-Chuan Lin 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 747 KB

Mechanical and Electrical Properties of

✍ Ja-Myeong Koo; Bui Quoc Vu; Yu-Na Kim; Jong-Bum Lee; Jong-Woong Kim; Dae-Up Kim; 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 378 KB