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Thermomechanical response of a lead-free solder reinforced with a shape memory alloy

โœ Scribed by Z.X. Wang; I. Dutta; B.S. Majumdar


Book ID
113895829
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
401 KB
Volume
54
Category
Article
ISSN
1359-6462

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