✦ LIBER ✦
Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy
✍ Scribed by Z.X. Wang; I. Dutta; B.S. Majumdar
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 734 KB
- Volume
- 421
- Category
- Article
- ISSN
- 0921-5093
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