𝔖 Bobbio Scriptorium

✦ LIBER ✦

Thermocompression bonding of copper leads plated with thin gold : N. T. Panousis and P. M. Hall. Proc. Electron. Components Conf. Arlington, Va., May 16–18, 1977. p. 220

Publisher: Elsevier Science
Year: 1977
Tongue: English
Weight: 129 KB
Volume: 16
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(77)90537-6

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Properties of die bond alloys relating t

Properties of die bond alloys relating to thermal fatigue : Dennis R. Olsen and Howard M. Berg. Proc. Electron. Components Conf. Arlington, Va., May 16–18, 1977. p. 193

📂 Article 📅 1977 🏛 Elsevier Science 🌐 English ⚖ 129 KB

Corrosion of solder-coated TiPdAu thin-f

Corrosion of solder-coated TiPdAu thin-film conductors in a moist chlorine atmosphere : F. N. Fuss and C. T. Hartwig. Proc. Electron. Components Conf. Arlington, Va., (May 16–18 1977). p. 72

📂 Article 📅 1978 🏛 Elsevier Science 🌐 English ⚖ 127 KB

Reliability assessment of beam-lead seal

Reliability assessment of beam-lead sealed-junction integrated circuits in polymer sealed packages : K. B. Lasch, W. N. Schaitter and R. Ilgendritz. Proc. Electron. Components Conf. Arlington, Va., May 16–18, 1977. p. 429

📂 Article 📅 1977 🏛 Elsevier Science 🌐 English ⚖ 134 KB

The consideration of reliability in a fu

The consideration of reliability in a fully automatic assembly system of small signal transistors : Y. Sakamoto, Y. Kondo, M. Ejiri, T. Takagi, H. Kawase and T. Oshio. Proc. Electron. Components Conf. Arlington, Va., May 16–18, 1977. p. 146

📂 Article 📅 1977 🏛 Elsevier Science 🌐 English ⚖ 134 KB