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Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization

✍ Scribed by Tsai, Ming-Hung; Wang, Chun-Wen; Lai, Chia-Han; Yeh, Jien-Wei; Gan, Jon-Yiew

No coin nor oath required. For personal study only.

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