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Thermally induced structural and compositional modification of the Cu/Si(111)-7×7 interface

✍ Scribed by Chambers, S. A.

Book ID: 127059607
Publisher: AVS (American Vacuum Society)
Year: 1985
Tongue: English
Weight: 739 KB
Volume: 3
Category: Article
ISSN: 0734-2101
DOI: 10.1116/1.572947

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