๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Thermally activated flow of H.C.P. metals at low temperatures

โœ Scribed by Sastry, D. H. ;Luton, M. J. ;Jonas, J. J.

Publisher
John Wiley and Sons
Year
1976
Tongue
English
Weight
749 KB
Volume
33
Category
Article
ISSN
0031-8965

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Thermal conductance of metal interfaces
Thermal conductance of metal interfaces at low temperatures
โœ B. Schumann; F. Nitsche; G. Paasch ๐Ÿ“‚ Article ๐Ÿ“… 1980 ๐Ÿ› Springer US ๐ŸŒ English โš– 779 KB

In the present work the dependence of the heat transfer coefficient between Cu and Sn, Cu and Pb, and Cu and W on the temperature and an external magnetic lieM has been measured. The preparation of the metal-metal junctions has been performed by melting so that a close contact at the interface was g

Thermal expansion at low temperatures of
Thermal expansion at low temperatures of anisotropic metals: Indium
โœ J.G. Collins; J.A. Cowan; G.K. White ๐Ÿ“‚ Article ๐Ÿ“… 1967 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 528 KB

In this paper the authors describe their work on two 99.99 per cent pure samples of indium at temperatures down to 1"5 ยฐ K. The expansion characteristics have been determined to this temperature with three points in mind: first the effect of anisotropy ; second the electronic contribution and its co