✦ LIBER ✦

Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substrates

✍ Scribed by A. K. Sinha; H. J. Levinstein; T. E. Smith

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Rapid thermal annealing of YBaCuO thin f

✍ J. Baixeras; F. Carrie; F.Hosseini Teherani; A. Kreisler 📂 Article 📅 1990 🏛 Elsevier Science ⚖ 396 KB

Dielectric function of Si-SiO2 and Si-Si

✍ Aspnes, D. E.; Theeten, J. B. 📂 Article 📅 1979 🏛 American Institute of Physics 🌐 English ⚖ 789 KB

Annealing studies of coupled Si3N4and Si

✍ H. Du; R. E. Tressler; K. E. Spear; M. Wang 📂 Article 📅 1989 🏛 Springer 🌐 English ⚖ 249 KB

Growth and characterization of ZnO films

✍ B.S. Panwar; A.B. Bhattacharyya; K.C. Nagpal; R.P. Mall 📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 798 KB

Characterization of superconducting YBa

✍ J. Marfaing; A. Bettahi; C. Boulesteix; P. Odier; J.P. Sorbier 📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 344 KB

Thermal conductivity and diffusivity of

✍ F Völklein 📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 290 KB