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Thermal stress intensity factors for partially insulated interface crack under uniform heat flow

โœ Scribed by Kang Yong Lee; Sang-Joon Park

Book ID
107752554
Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
370 KB
Volume
50
Category
Article
ISSN
0013-7944

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๐Ÿ“œ SIMILAR VOLUMES

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Ahatract-In the case where an interface crack exists in an intinite two-dimensional elastic bimaterial, the crack surface is insulated under traction-free conditions and the uniform heat flow vertical to the crack from an infinite boundary is given, temperature and stress potentials are obtained by

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The steady state thermal stress intensity factors (TSIF'S) are analysed for hypocycloid, symmetric airfoil and symmetric lip type rigid cusp cracks embedded in infinite elastic solids, using BogdanotTs complex variable approach in plane thermoelasticity. Two thermal conditions are considered, one wi

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## Abatnct -The thermal stress intensity factors (TSIF's) for the cusp cracks such as hypocycloid crack, symmetric airfoil crack and symmetric lip crack are determined by using Bogdanofh complex variable approaches in plane themmelasticity. The results are expressed in terms of periodic functions