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Determination of thermal stress intensity factors for an interface crack under vertical uniform heat flow

โœ Scribed by Kang Yong Lee; Chang Won Shul


Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
525 KB
Volume
40
Category
Article
ISSN
0013-7944

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โœฆ Synopsis


Ahatract-In the case where an interface crack exists in an intinite two-dimensional elastic bimaterial, the crack surface is insulated under traction-free conditions and the uniform heat flow vertical to the crack from an infinite boundary is given, temperature and stress potentials are obtained by using the complex variable approach to solve Hilbert problems, and the results are used to obtain thermal stress intensity factors. The mode II thermal stress intensity factor only occurs if both the shear moduli, as well as the Poisson's ratios in the upper and lower material, are the same. otherwise, mode I and II thermal stress intensity factors exist but the value of the mode I thermal stress intensity factor is much smaller than that of mode II.


๐Ÿ“œ SIMILAR VOLUMES


Determination of thermal stress intensit
โœ Kang Yong Lee; Heung Soap Choi ๐Ÿ“‚ Article ๐Ÿ“… 1989 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 613 KB

The steady state thermal stress intensity factors (TSIF'S) are analysed for hypocycloid, symmetric airfoil and symmetric lip type rigid cusp cracks embedded in infinite elastic solids, using BogdanotTs complex variable approach in plane thermoelasticity. Two thermal conditions are considered, one wi

Determination of thermal stress intensit
โœ Kang Yong Lee; Heung Soap Choi ๐Ÿ“‚ Article ๐Ÿ“… 1988 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 670 KB

## Abatnct -The thermal stress intensity factors (TSIF's) for the cusp cracks such as hypocycloid crack, symmetric airfoil crack and symmetric lip crack are determined by using Bogdanofh complex variable approaches in plane themmelasticity. The results are expressed in terms of periodic functions