Thermal stress and strain in microelectronics packaging: Editor: John H. Lau Publisher: International Thomson Publishing Berckshire House 168-173 High Holborn London WC1V 7AA England Price: 74.50 GBP (ISBN: 0-442-01058-3) Published in 1993

✍ Scribed by N.D. Stojadinović

• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 108 KB
• Volume: 34
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(94)90055-8