Thermal stress analysis of composite encapsulants with a spherical adhesive interface: A. S. Jordan and G. W. Berkstresser. Microelectron. Reliab. 20, 495 (1980)

• Publisher: Elsevier Science
• Year: 1981
• Tongue: English
• Weight: 108 KB
• Volume: 21
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(81)90364-4