Thermal stress analysis of composite encapsulants with a spherical adhesive interface
โ Scribed by A.S Jordan; G.W Berkstresser
- Publisher
- Elsevier Science
- Year
- 1980
- Tongue
- English
- Weight
- 385 KB
- Volume
- 20
- Category
- Article
- ISSN
- 0026-2714
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