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Thermal stress analysis for polyimide thin film: The effect of solvent evaporation

✍ Scribed by Sang Hun Lee; Young Chan Bae

Publisher: John Wiley and Sons
Year: 2000
Tongue: English
Weight: 83 KB
Volume: 9
Category: Article
ISSN: 1022-1344
DOI: 10.1002/1521-3919(20000601)9:5<281::aid-mats281>3.0.co;2-f

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