Thermal stress analysis for polyimide thin film and a substrate layer system

✍ Scribed by Sang Hun Lee; Young Chan Bae

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 81 KB
• Volume: 201
• Category: Article
• ISSN: 1022-1352
• DOI: 10.1002/1521-3935(20000801)201:12<1286::aid-macp1286>3.0.co;2-k