✦ LIBER ✦

Thermal stability of Cu(W) and Cu(Mo) films for advanced barrierless Cu metallization: Effects of annealing time

✍ Scribed by J. P. Chu; C. H. Lin

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermal performance of sputtered insolub

✍ J. P. Chu; C. H. Lin; Y. Y. Hsieh 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 200 KB

Thermal performance of sputtered Cu film

✍ Xin-jian WANG; Xian-ping DONG; Chuan-hai JIANG 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 694 KB

Thermal and electrical stability of TaNx

✍ Dalili, Neda; Liu, Qi; Ivey, Douglas G. 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 751 KB

A new field-assisted annealing approach

✍ Ying Wang, Fei Cao, Mi-lin Zhang 📂 Article 📅 2012 🏛 The Korean Institute of Metals and Materials 🌐 English ⚖ 537 KB

Study of Ti/W/Cu, Ti/Co/Cu, and Ti/Mo/Cu

✍ H. C. Chang; C. S. Lee; S. H. Chen; E. Y. Chang; J. Z. He 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 94 KB

Thermal stability of Ti/Mo and Ti/MoN na

✍ Majumder, Prodyut; Takoudis, Christos 📂 Article 📅 2008 🏛 Institute of Physics 🌐 English ⚖ 751 KB