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Thermal stability and compatibility of epoxy/polycarbonate and epoxy/tetramethyl polycarbonate blends

โœ Scribed by Doo Sung Lee; Yongsei Kim; Byounglyoul Park; Jinhwan Kim


Publisher
John Wiley and Sons
Year
1996
Tongue
English
Weight
979 KB
Volume
59
Category
Article
ISSN
0021-8995

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โœฆ Synopsis


A series of the blends of tetrafunctional epoxy resins with polycarbonate (PC) or tetramethyl polycarbonate (TMPC) was prepared to investigate thermal stability and compatibility. The Tg behavior as a function of isothermal curing time was observed. The thermal stability of epoxy and epoxy/thermoplastics blends was estimated using thermogravimetric analysis (TGA). Fourier transform infrared (FTIR) investigation demonstrated the occurrence of thermal degradation and hydrolysis in epoxy and epoxy/PC blends during the curing process. The thermal degradation of cured epoxy was induced with etherification, a sort of side reaction, and resulted in the chain scission of networks leading to the decrease of Te

The variance of thermal stability with a combination of two components in these blends resulted from the difference of the compatibility due to chemical structure similarity. The compatibility was corroborated with the morphology by scanning electron microscopy (SEM).


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