Nearly all IC encapsulating compounds require a postcure treatment to ensure integrated circuit (IC) package reliability. The issue of postcuring and this effect on IC package reliability performance are considered in this article. We examined the development of various encapsulating compounds' prop
Thermal shock resistance of plastic IC package
โ Scribed by Yoshitsugu Kojima; Takashi Ohta; Mitsumasa Matsushita; Minoru Takahara; Toshio Kurauchi
- Publisher
- John Wiley and Sons
- Year
- 1990
- Tongue
- English
- Weight
- 359 KB
- Volume
- 41
- Category
- Article
- ISSN
- 0021-8995
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