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Thermal shock and thermal fatigue study of ceramic materials on a newly developed ascending thermal shock test equipment

โœ Scribed by Panda, P.K; Kannan, T.S; Dubois, J; Olagnon, C; Fantozzi, G

Book ID
122523494
Publisher
Institute of Physics and National Institute of Materials Science
Year
2002
Tongue
English
Weight
343 KB
Volume
3
Category
Article
ISSN
1468-6996

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In this work, the first reliability results of Thermal Cycling Tests (TCT, air-air test) and Thermal Shock Tests (TST, liquidliquid test) on medium power electronic components are discussed. The influence of dwell times, extremes temperatures and mean temperature is investigated. This study is based