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Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

✍ Scribed by Collins, M.N.; Punch, J.; Coyle, R.; Reid, M.; Popowich, R.; Read, P.; Fleming, D.

Book ID: 119815825
Publisher: Institute of Electrical and Electronics Engineers
Year: 2011
Tongue: English
Weight: 881 KB
Volume: 1
Category: Article
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2011.2150223

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