✦ LIBER ✦

Thermal expansion of Cu6Sn5 and (Cu,Ni) 6Sn5

✍ Scribed by Mu, Dekui (author);Read, Jonathan (author);Yang, Yafeng (author);Nogita, Kazuhiro (author)

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermal expansion of Cu6Sn5 and (Cu,Ni)

✍ Mu, Dekui (author);Read, Jonathan (author);Yang, Yafeng (author);Nogita, Kazuhir 📂 Article 📅 2011 🏛 Cambridge University Press 🌐 English ⚖ 400 KB

Anisotropic mechanical properties of Cu6

✍ D. Mu; H. Huang; K. Nogita 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 742 KB

Creep and Mechanical Properties of Cu6Sn

✍ Dekui Mu, Han Huang, Stuart D. McDonald, Kazuhiro Nogita 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 483 KB

Nanotribological Characteristics of Cu6S

✍ Ping-Feng Yang; Sheng-Rui Jian; Yi-Shao Lai; Rong-Sheng Chen 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 364 KB

Growth Mechanism of a Ternary (Cu,Ni)6Sn

✍ T. S. Huang; H. W. Tseng; C. T. Lu; Y. H. Hsiao; Y. C. Chuang; C. Y. Liu 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 414 KB

Nickel-stabilized hexagonal (Cu, Ni

✍ Kazuhiro Nogita; Tetsuro Nishimura 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 848 KB