Fabrication and properties of alumino-bo
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Bi-Shiou Chiou; Jyh-Ming Tzeng; Jenq-Gong Duh
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Article
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1993
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Springer US
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English
โ 363 KB
In current microelectronics packaging applications, low-temperature fired substrates with low dielectric constant are required. Formulations of SiO2, B203, AI203, and CaO have been used as substrate materials which can be sintered as low as 1000ยฐC in air. The electrical behaviour, thermal expansion