Fabrication and properties of alumino-borosilicate glass-ceramic systems

✍ Scribed by Bi-Shiou Chiou; Jyh-Ming Tzeng; Jenq-Gong Duh

• Publisher: Springer US
• Year: 1993
• Tongue: English
• Weight: 363 KB
• Volume: 4
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/bf00179228

✦ Synopsis

In current microelectronics packaging applications, low-temperature fired substrates with low dielectric constant are required. Formulations of SiO2, B203, AI203, and CaO have been used as substrate materials which can be sintered as low as 1000°C in air. The electrical behaviour, thermal expansion coefficient, and mechanical property of the fabricated substrate materials are evaluated. The as-sintered substrates possess the following characteristics: low dielectric constant of 4-5 at 1 MHz; a loss factor smaller than 0.2% at 1 MHz; and a thermal expansion of 3.57 x 10 -6 °C-1 which is very close to that of silicon (3.5 x 10 -6 °C-1).