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Thermal conductance of Cu/Cu and Cu/Si interfaces from 85 K to 300 K

✍ Scribed by June Yu; A.L. Yee; R.E. Schwall

Book ID: 107746394
Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 565 KB
Volume: 32
Category: Article
ISSN: 0011-2275
DOI: 10.1016/0011-2275(92)90291-h

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