Thermal characterization of polymeric materials used in semiconductor die bonding

✍ Scribed by D.E. Eisenmann; S.M. Halyard Jr.

• Publisher: Elsevier Science
• Year: 1976
• Tongue: English
• Weight: 667 KB
• Volume: 14
• Category: Article
• ISSN: 0040-6031
• DOI: 10.1016/0040-6031(76)80059-7