✦ LIBER ✦

Thermal characteristics of MMIC package

✍ Scribed by Feng Cheng; Quanrang Yang

Publisher: John Wiley and Sons
Year: 2000
Tongue: English
Weight: 130 KB
Volume: 25
Category: Article
ISSN: 0895-2477
DOI: 10.1002/(sici)1098-2760(20000620)25:6<368::aid-mop2>3.0.co;2-0

No coin nor oath required. For personal study only.

✦ Synopsis

An analysis of the thermal characteristics of the MMIC package is presented in this paper by sol¨ing the heat transport equation using the heat balance method. According to the result, which includes the temperature ¨ariation, the temperature distribution, and the maximum temperature in the package, the maximum power of the packaged de¨ices can be limited in order to protect the packaged circuits from a high temperature.

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