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Thermal breakdown simulation of Si MOSFET taking account of thermal interdependence

โœ Scribed by Hirobumi Kawashima; Ryo Dang


Publisher
John Wiley and Sons
Year
1999
Tongue
English
Weight
170 KB
Volume
82
Category
Article
ISSN
8756-663X

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Although the high mobility channel was formed with the strained Si layer on the fully relaxed Si 0.8 Ge 0.2 buffer layer, the mobility was severely attenuated with increasing the gate bias due to the degraded interface. The quality of oxide grown on strained Si was found to be worse than that for th