Thermal analysis of photoresists in aid of lithographic process development

✍ Scribed by E. Tegou; E. Gogolides; M. Hatzakis

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 257 KB
• Volume: 35
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(96)00174-8

✦ Synopsis

A methodology is presented using thermal analysis to aid lithographic process development and/or photoresist evaluation. The temperature ranges of the reactions occurring in the photoresist film during baking cycles, and the apparent glass transition temperatures (Tg) of the films are determined, and used for prebake and post-exposure bake optimisation. The methodology is applied for several commercial photoresists, namely UVIII*, XP 90166", EPR*, and AZ 5214", for which optimum baking temperature ranges are determined. * UVIII and XP 90166 are trademarks of Shipley Co, AZ 5214 is a trademark of Hoechst Co, and EPR is developed by the Institute of Microelectronics.