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Analysis of pattern height development in hot embossing process

✍ Scribed by Yong He; Jian-Zhong Fu; Zi-Chen Chen

Publisher: Springer-Verlag
Year: 2009
Tongue: English
Weight: 303 KB
Volume: 15
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s00542-009-0858-6

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