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Thermal analysis of encapsulants for tape automated bonded (TAB) applications

✍ Scribed by Indira S. Adhihetty; Paul W. Deal; R.Paddy Padmanabhan

Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 745 KB
Volume: 212
Category: Article
ISSN: 0040-6031
DOI: 10.1016/0040-6031(92)80239-s

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