✦ LIBER ✦
Thermal stress analysis of tape automated bonding packages and interconnections : John H. Lau, Donald W. Rice and C. Girvin Harkins. IEEE Trans. Compon. Hybrids mfg Technol. 13(1), 182 (1990)
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 133 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0026-2714
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