๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Thermal Analysis and Optimum Fin Length of a Heat Sink

โœ Scribed by Kou, Hong-Sen; Lee, Ji-Jen; Lai, Chi-Yuan


Book ID
120085947
Publisher
Taylor and Francis Group
Year
2003
Tongue
English
Weight
331 KB
Volume
24
Category
Article
ISSN
0145-7632

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


An optimum die fillet design for minimiz
โœ Chin-Tarn Kwan; Fu-She Jan; Wen-Chung Lee ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 334 KB

In this paper, an optimum die fillet design for minimizing the maximum difference in extruded fin lengths of straight-fin heat sink extrusion is proposed. The fillets on the extrusion die openings are chosen as the optimizing parameters of the extrusion process first, and then the experimental desig

Numerical Analysis of Novel Micro Pin Fi
โœ Rubio-Jimenez, C.A.; Kandlikar, S.G.; Hernandez-Guerrero, A. ๐Ÿ“‚ Article ๐Ÿ“… 2012 ๐Ÿ› Institute of Electrical and Electronics Engineers ๐ŸŒ English โš– 939 KB

Numerical analyses to characterize and design micro pin fin heat sinks for cooling the 2016s IC chip heat generation are carried out in this paper. A novel design with variable fin density is proposed to generate a more uniform temperature of the IC chip junctions. The variable-density feature allow