Numerical analyses to characterize and design micro pin fin heat sinks for cooling the 2016s IC chip heat generation are carried out in this paper. A novel design with variable fin density is proposed to generate a more uniform temperature of the IC chip junctions. The variable-density feature allow
β¦ LIBER β¦
Numerical Analysis of Novel Micro Pin Fin Heat Sink With Variable Fin Density
β Scribed by Rubio-Jimenez, C.A.; Kandlikar, S.G.; Hernandez-Guerrero, A.
- Book ID
- 117913378
- Publisher
- Institute of Electrical and Electronics Engineers
- Year
- 2012
- Tongue
- English
- Weight
- 939 KB
- Volume
- 2
- Category
- Article
- ISSN
- 2156-3950
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Numerical Analysis of Novel Micro Pin Fi
β
Rubio-Jimenez, C.A.; Kandlikar, S.G.; Hernandez-Guerrero, A.
π
Article
π
2012
π
Institute of Electrical and Electronics Engineers
π
English
β 939 KB
Exergo-economic analysis of micro pin fi
β
Ali KoΕar
π
Article
π
2010
π
John Wiley and Sons
π
English
β 319 KB
A parametric study of thermoeconomic performance over four micro pin fin heat sinks of different spacing and shapes was conducted. Unit cost per product exergy, relative cost difference, and exergo-economic factor were utilized to evaluate the thermoeconomic performance. The effect of working fluid
Numerical modeling of pinβfin micro heat
β
E. Galvis; B. A. Jubran; F. XI. K. Behdinan; Z. Fawaz
π
Article
π
2007
π
Springer-Verlag
π
English
β 525 KB
Development of a plate-pin fin heat sink
β
Xiaoling Yu; Jianmei Feng; Quanke Feng; Qiuwang Wang
π
Article
π
2005
π
Elsevier Science
π
English
β 462 KB
Analysis of flow and heat transfer chara
β
MingZheng Zhou; GuoDong Xia; Lei Chai; Jian Li; LiJun Zhou
π
Article
π
2011
π
SP Science China Press
π
English
β 783 KB
Performance Analysis of Pin-Fin Heat Sin
β
Hung-Yi Li; Ming-Hung Chiang; Kuan-Ying Chen
π
Article
π
2007
π
IEEE
π
English
β 760 KB