The use of reflow soldered face bonded chips in hybrid integrated circuits : P. F. Castle and A. F. Khambatta, Proc. Tech. Prog. INTER/NEPCON 1969, Brighton, 14–16 October (1969), p. 125

• Book ID: 103273701
• Publisher: Elsevier Science
• Year: 1970
• Tongue: English
• Weight: 114 KB
• Volume: 9
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(70)90173-3