The use of reflow soldered face bonded chips in hybrid ICs—I. : F. F. Castle and A. F. Khambatta, Microelectronics, November (1969), p. 36

• Book ID: 103268478
• Publisher: Elsevier Science
• Year: 1970
• Tongue: English
• Weight: 101 KB
• Volume: 9
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(70)90386-0