The use environments of electronic assemblies and their impact on surface mount solder attachment reliability

✍ Scribed by Engelmaier, W.

• Book ID: 117872780
• Publisher: IEEE
• Year: 1990
• Tongue: English
• Weight: 613 KB
• Volume: 13
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.62538