The single chip versus multichip packaging option for digital CMOS in the 1990s

✍ Scribed by Neugebauer, C.A.; Fillion, R.A.; Daum, W.; Gdula, M.

• Book ID: 114560383
• Publisher: IEEE
• Year: 1992
• Tongue: English
• Weight: 683 KB
• Volume: 15
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.180058