✦ LIBER ✦

The Role of SPS, MPSA, and Chloride in Additive Systems for Copper Electrodeposition

✍ Scribed by Tan, Min; Guymon, Clint; Wheeler, Dean R.; Harb, John N.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Electrodeposition of Copper in the SPS-P

✍ Moffat, T. P.; Wheeler, D.; Josell, D. 📂 Article 📅 2004 🏛 The Electrochemical Society 🌐 English ⚖ 239 KB

Influence of Chloride and Nitrate Anions

✍ Ramos, Aurora; Miranda-Hernández, Margarita; González, Ignacio 📂 Article 📅 2001 🏛 The Electrochemical Society 🌐 English ⚖ 136 KB

In Situ EC-STM Studies of MPS, SPS, and

✍ Bae, Sang-Eun; Gewirth, Andrew A. 📂 Article 📅 2006 🏛 American Chemical Society 🌐 English ⚖ 747 KB

Kinetic and morphological investigation

✍ S. Varvara; L. Muresan; A. Nicoara; G. Maurin; I.C. Popescu 📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 179 KB

Role of copper chlorides in the Sandmeye

✍ Dickerman, S. Carlton; DeSouza, Derek J.; Jacobson, Norman 📂 Article 📅 1969 🏛 American Chemical Society 🌐 English ⚖ 545 KB

The role of migration mass transfer in t

✍ A. A. Sedoikin; T. E. Tsupak 📂 Article 📅 2008 🏛 SP MAIK Nauka/Interperiodica 🌐 English ⚖ 217 KB