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The role of grain boundary plane orientation on intergranular corrosion of symmetric and asymmetric [1 1 0] tilt grain boundaries in directionally solidified pure copper

✍ Scribed by H. Miyamoto; K. Ikeuchi; T. Mimaki

No coin nor oath required. For personal study only.

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The role of grain boundary plane orientation on intergranular corrosion of symmetric and asymmetric [1&#xa0;1&#xa0;0] tilt grain boundaries in directionally solidified pure copper