Behavior of intergranular corrosion of 〈0 1 1〉 tilt grain boundaries of pure copper bicrystals
✍ Scribed by H Miyamoto; K Yoshimura; T Mimaki; M Yamashita
- Book ID
- 117085799
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 807 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0010-938X
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Stress-induced migration of planar grain boundaries in aluminum bicrystals was measured for both low-and high-angle symmetrical h1 0 0i tilt grain boundaries across the entire misorientation range (0-90°). Boundary migration under a shear stress was observed to be coupled to a lateral translation of
The motion of planar symmetric [1 0 0]-tilt grain boundaries in high purity aluminium under cyclic elastic deformation conditions was investigated. Bicrystals were fabricated to obtain grain boundaries with different misorientation angles between 3.7 • and 42.5 • . They were deformed under cyclic te