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The relationship between dielectric and rheological behavior of epoxy resin during cure

✍ Scribed by Jung-Yun Chen; Pieng-Tsung Huang; Sung-Nung Lee

Publisher
Springer
Year
1994
Tongue
English
Weight
724 KB
Volume
1
Category
Article
ISSN
1022-9760

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πŸ“œ SIMILAR VOLUMES

Variations of the dielectric properties
Variations of the dielectric properties of epoxy resins during microwave curing
✍ Michel Delmotte; Henri Jullien; Michel Ollivon πŸ“‚ Article πŸ“… 1991 πŸ› Elsevier Science 🌐 English βš– 517 KB

The curing of a particular epoxy resin (digiycidylether of bisphenol-A) by three amino hardeners (4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulphone and 4,4'-diaminodiphenylether) is followed by dielectric measurements performed under microwave heating. The formation on heating of a molecular