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Curing of an epoxy resin modified with nanoclay monitored by dielectric spectroscopy and rheological measurements

✍ Scribed by G. Kortaberria; L. Solar; A. Jimeno; P. Arruti; C. Gómez; I. Mondragon


Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
214 KB
Volume
102
Category
Article
ISSN
0021-8995

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