✍ Scribed by A.J. Rosenberg
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
The oxidation of Cu-Sn intermetallic compounds is of significant technological interest in relation to the wetting behavior of Sn-base solders to Cu and Cu alloys. However, there are very few studies on this subject in the literature. In this present study, oxide films formed on the intermetallic co
Using the technique of molecular modulation spectrometry, we have measured directly the rate constants of several reactions involved in the oxidation of methyl radicals at room temperature: (1) kl is in the fall-off pressure regime at our experimental pressures (20-760 torr) where the order lies b
Deformation behavior of MgCu, Laves phase intermetallic compound were studied by compression experiments. MgCu, was plastically deformed at the temperature above 673 K, when the strain-rate was low. The large temperature and strain-rate dependences of the stress and small activation volumes obtained