XPS Study of the Oxidation Behavior of the Cu3Sn Intermetallic Compound at Low Temperatures

✍ Scribed by Wang, DongNing; Miller, Alfred C.; Notis, Michael R.

• Publisher: John Wiley and Sons
• Year: 1996
• Tongue: English
• Weight: 383 KB
• Volume: 24
• Category: Article
• ISSN: 0142-2421
• DOI: 10.1002/(sici)1096-9918(199602)24:2<127::aid-sia110>3.0.co;2-z

✦ Synopsis

The oxidation of Cu-Sn intermetallic compounds is of significant technological interest in relation to the wetting behavior of Sn-base solders to Cu and Cu alloys. However, there are very few studies on this subject in the literature. In this present study, oxide films formed on the intermetallic compound Cu,Sn in pure 0, at temperatures <350 "C have been analyzed using XPS. Single-phase samples of different Cu-Sn intermetallic compounds, made by hot isostatic pressing of rapidly solidified powders, were provided by NIST. The sample surfaces were mechanically cleaned, and oxidized in situ in the XPS chamber. Results obtained so far indicate that the oxidation behavior of E-Cu3Sn, in terms of both microchemistry and growth kinetics, is strongly temperature dependent. A tin oxide film was observed at 150-2OO0C, while a mixed copper and tin oxide film was noted at 350 "C. Results for oxidation of &-Cu,Sn are interpreted in terms of available phase equilibria and growth kinetics data.