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The interconnection and packaging of thick film microcircuits : R. Ilgenfritz and L. Mogey, Proc. 1970 20th Electronic Components Conf., Washington, 13–15 May (1970), p. 122

Publisher: Elsevier Science
Year: 1971
Tongue: English
Weight: 113 KB
Volume: 10
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(71)90523-3

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