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The influence of tungsten on the thermal stability and mechanical behavior of electrodeposited nickel MEMS structures

✍ Scribed by S.J. Suresha; M. Haj-Taieb; K. Bade; J. Aktaa; K.J. Hemker

Book ID: 113898603
Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 523 KB
Volume: 63
Category: Article
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2010.07.015

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