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Temperature effects on the mechanical reliability of MEMS structures: experimental study on creep and thermal fatigue

✍ Scribed by De Pasquale, G.; Brusa, E.; Somà, A.

Book ID
120348589
Publisher
EDP Sciences
Year
2010
Tongue
English
Weight
872 KB
Volume
6
Category
Article
ISSN
2100-014X

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high temperature creep, fatigue and creep-fatigue interaction, several authors have recently attempted to express crack growth rate in terms of stress intensity factor K, = a& u8, where a is the equivalent crack length as the sum of the initial notch length a, and the actual crack length a\*, that i