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The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

✍ Scribed by Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao

No coin nor oath required. For personal study only.

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